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We will exhibit at Advanced Packaging and Chiplet Summit
Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)
For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities
Exhibit Products：
- High Adhesion-easy Removable UV Tape SELFA™
- Clean Container series
- High-viscosity inkjet ink
- EPOXY FLUX (Under development)
- Adhesive (PSA) Dot Connector
Sekisui Chemical Exhibit Area East Exhibition Hall 3452
We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.
2024.11.12
Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)
- Date
- September 25-27, 2024 (Wed-Fri)
- Venue
- September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
- Official Website
- https://3dic-conf.org/
Our Schedule
■ Session Presentation
- Title
- "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
- Presentation Date & Time
- September 26, 10:45 AM - 11:05 AM
※3DIC_Program_Schedule : For more details
- Exhibition Period
- September 26, 2024 - September 27, 2024
- Venue
- Sendai Kokusai Hotel
- Booth Number
- #12
2024.09.02
過往信息
2023.11.17
最優(yōu)秀論文受獎(jiǎng): 積水化學(xué)開発品「高耐熱假貼UV易解離膠帶-耐熱SELFA™」
- 得獎(jiǎng)作者
- 岡村和泉、渡邊良一、高橋駿夫及其他4位開發(fā)人員。
（隸屬于積水化學(xué)高機(jī)能Plastic Company開発研究所）
2023.11.02
2023年12月13日-15日 (五)10:00-17:00 于 東京Big Sight國際展示中心 (東展覽館)
2023.08.28
- Duration
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
2023.08.02
EMC/China 第20屆電磁兼容暨微波天線展覽會(huì) &
EDWTech 高速通信與電子設(shè)計(jì)會(huì)
- 會(huì)期
- 2023年8月9日（周三）-8月11日（周五）
- 地點(diǎn)
- 上海世博展覽館
積水化學(xué)展區(qū) : 3館2樓1147號(hào)
2023.05.26
2023年IEEE第73屆電子元器件與技術(shù)會(huì)議(ECTC2023) 出展
- 會(huì)期
- 2023年5月30日（周二）-6月2日（周五）
- 地點(diǎn)
- 格蘭德湖奧蘭多 JW 萬豪酒店
（美國佛羅里達(dá)州奧蘭多）
2022.12.26
Best Paper Award of IMPACT 2022 !!
At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA™series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA™)
Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi
2022.11.07
積水化學(xué)出展「先進(jìn)封裝及小晶片高峰會(huì)」Advanced Packaging and Chiplet Summit
東京國際展示中心 (東展覽館 1-3) 2022年12月14日-16日 (五)10:00-17:00
2022.10.07
We will make a presentation at IMPACT2022
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
2021.06.01
參加并在ECTC上針對以下兩項(xiàng)研究進(jìn)行了演講 ECTC (2021 IEEE 71st Electronic Components and Technology Conference)
①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages